Subtractive W contact and local interconnect co-integration (CLIC)
- Fei Liu
- Benjamin Fletcher
- et al.
- 2013
- IITC 2013
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108 results for Sebastian Engelmann
SiGe HBTs in 90nm BiCMOS technology demonstrating 300GHz/420GHz f T/fMAX through reduced Rb and Ccb parasitics
- Renata Camillo-Castillo
- Q. Liu
- et al.
- 2013
- BCTM 2013
High-performance Si1-xGex channel on insulator trigate PFETs featuring an implant-free process and aggressively-scaled fin and gate dimensions
- P. Hashemi
- M. Kobayashi
- et al.
- 2013
- VLSI Circuits 2013
High-performance Si1-xGex channel on insulator trigate PFETs featuring an implant-free process and aggressively-scaled fin and gate dimensions
- P. Hashemi
- M. Kobayashi
- et al.
- 2013
- VLSI Technology 2013
Advanced plasma etch for the 10nm node and beyond
- Eric Joseph
- Sebastian Engelmann
- et al.
- 2013
- SPIE Advanced Lithography 2013
Pattern transfer of directed self-assembly (DSA) patterns for CMOS device applications
- Hsin-Yu Tsai
- Hiroyuki Miyazoe
- et al.
- 2013
- SPIE Advanced Lithography 2013
Patterning of CMOS device structures for 40-80nm pitches and beyond
- Sebastian U. Engelmann
- R.M. Martin
- et al.
- 2012
- SPIE Advanced Lithography 2012
The effects of plasma exposure on low-k dielectric materials
- J.L. Shohet
- H. Ren
- et al.
- 2012
- SPIE Advanced Lithography 2012
Improved frequency response in a SiGe npn device through improved dopant activation
- Jim Adkisson
- Marwan H. Khater
- et al.
- 2012
- ECS Meeting 2012
Scaling of SOI FinFETs down to fin width of 4 nm for the 10nm technology node
- Josephine Chang
- Michael A. Guillorn
- et al.
- 2011
- VLSI Technology 2011