Novel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2017
- ECTC 2017
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108 results for Sebastian Engelmann
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension
- Yves Martin
- Jae Woong Nah
- et al.
- 2016
- ECTC 2016
Sub-Micron Bondline-Shape Control in Automated Assembly of Photonic Devices
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2016
- ECTC 2016
Automated, self-aligned assembly of 12 fibers per nanophotonic chip with standard microelectronics assembly tooling
- Tymon Barwicz
- Nicolas Boyer
- et al.
- 2015
- ECTC 2015
Flip chip assembly with sub-micron 3D re-alignment via solder surface tension
- Jae Woong Nah
- Yves Martin
- et al.
- 2015
- ECTC 2015
First demonstration of high-Ge-content strained-Si1-xGex (x=0.5) on insulator PMOS FinFETs with high hole mobility and aggressively scaled fin dimensions and gate lengths for high-performance applications
- Pouya Hashemi
- Karthik Balakrishnan
- et al.
- 2014
- IEDM 2014
Electrical characterization of FinFETs with fins formed by directed self assembly at 29 nm fin pitch using a self-aligned fin customization scheme
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2014
- IEDM 2014
An integrated silicon photonics technology for O-band datacom
- N. Feilchenfeld
- Frederick A. Anderson
- et al.
- 2015
- IEDM 2015
Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips
- Tymon Barwicz
- Yoichi Taira
- et al.
- 2014
- ECTC 2014
Density scaling with gate-all-around silicon nanowire MOSFETs for the 10 nm node and beyond
- Sarunya Bangsaruntip
- K. Balakrishnan
- et al.
- 2013
- IEDM 2013