Publication
GFP 2015
Conference paper

Enabling large-scale deployment of photonics through cost-efficient and scalable packaging

View publication

Abstract

Enabling single-mode photonic packaging in high-throughput microelectronic equipment can dramatically improve cost and scalability. We experimentally demonstrate such solution using 12-fiber interfaces and flipped-chip lasers. We measure -1.3dB peak fiber-to-chip transmission.

Date

23 Oct 2015

Publication

GFP 2015

Authors

Share