Publications

64 results for Nick Lanzillo

First-Principles Evaluation of fcc Ruthenium for its use in Advanced Interconnects
- - Timothy M. Philip
  - Nicholas A. Lanzillo
  - et al.
- 2020
- Physical Review Applied
Structural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects
- - Nicholas A. Lanzillo
  - Lawrence Clevenger
  - et al.
- 2020
- Journal of Applied Physics
Surface initiated polymer thin films for the area selective deposition and etching of metal oxides
- - Thomas G. Pattison
  - Alexander E. Hess
  - et al.
- 2020
- ACS Nano
Chip Power-Frequency Scaling in 10/7nm Node
- - Phil Oldiges
  - Reinaldo A. Vega
  - et al.
- 2020
- IEEE Access
Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
- - Nicholas A. Lanzillo
  - Kisik Choi
  - et al.
- 2019
- IEEE Electron Device Letters
A Materials Screening Methodology for Scaled Non-Volatile Memory in the AI Era
- - Nicholas A. Lanzillo
  - R. R. Robison
- 2019
- ANTS 2019
Spin-dependent electron scattering in cobalt interconnects
- - Nicholas A. Lanzillo
  - P. Bhosale
  - et al.
- 2019
- Journal of Physics D: Applied Physics
Technology challenges and enablers to extend Cu metallization to beyond 7 nm node
- - Takeshi Nogami
  - H. Huang
  - et al.
- 2019
- VLSI Technology 2019
Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects
- - Nicholas A. Lanzillo
  - Benjamin D. Briggs
  - et al.
- 2019
- Computational Materials Science
An evaluation of Fuchs-Sondheimer and Mayadas-Shatzkes models below 14nm node wide lines
- - R. S. Smith
  - E. T. Ryan
  - et al.
- 2019
- AIP Advances