Publications

4 results for Chris Bottoms

Lithographic Process Optimization for Next-Generation Advanced Packaging Influenced by Wafer Topography and Reticle Stitching
- - Chris Bottoms
  - Sarah Nahar Chowdhury
  - et al.
- 2026
- SPIE Advanced Lithography + Patterning 2026
Conference paper
Multi-reticle stitching: Applications from packaging to High-NA EUV
- - Chris Bottoms
  - Rick Johnson
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Conference paper
Massive E-beam Metrology Characterization of Reticle Stitching Boundaries
- - Genevieve Kane
  - Connor Smith
  - et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Talk
Large Feature Wafer Level In-Line Optical Metrology Techniques for Advanced Packaging Schemes
- - Katherine Sieg
  - Chris Bottoms
  - et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Conference paper