This paper describes the categories of electron beam lithography tools which to us seem to be of most importance. The first is a thermal field emission source gaussian round beam system. The overall performance to accomplish 0.05 μm imaging capability is presented. The second is a finely tuned variably shaped beam system which has the capability of delineating 0.15 μm dimensions at moderate throughout. Both systems have been integrated into a lithography sector with resist and process engineering as an integral part. We have applied this complete lithography sector to a variety of device runs ranging from 0.25 μm fully sealed all c-beam lithography, partially sealed mixed with optics, to mixed e-beam with e-beam lithography for less than 0.1 μm dimensions. Several non-direct write applications have been performed, such as the fabrication of 0.15 μm X-ray test masks and also phase shifting masks, for which we need the accuracy and registration capability of a high resolution direct write tool.