Publication
ECTC 2014
Conference paper

Effect of Ag and Cu content in Sn based Pb-free solder on electromigration

View publication

Abstract

The effect of Ag and Cu concentrations on the electromigration of Pb-free solder was investigated. A nine cell experiment with Ag concentrations ranging from 1.2% to 2.2% and Cu concentrations ranging from 0.2 to 2.7% was conducted. Although the EM performance was found to be insensitive to the Ag and Cu concentrations in the range of the study, solder with 1.7% Cu showed the least Ag content dependence. EM failures occurred primarily on the substrate side. An effect of Sn grain texture with Ag and Cu concentrations was also observed.

Date

Publication

ECTC 2014

Authors

Share