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ASME Journal of Electronic Packaging
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A graphite foams based vapor chamber for chip heat spreading

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Abstract

A vapor chamber using high thermal conductivity and permeability graphite foam as a wick has been designed, built, and tested. With ethanol as the working fluid, the vapor chamber has been demonstrated at a heat flux of 80 W/cm 2. The effects of the capillary limit, the boiling limit, and the thermal resistance in restricting the overall performance of a vapor chamber have been analyzed. Because of the high thermal conductivity of the graphite foams, the modeling results show that the performance of a vapor chamber using a graphite foam is about twice that of one using a copper wick structure. Furthermore, if water is used as the working fluid instead of ethanol, the performance of the vapor chamber will be increased further. Graphite foam vapor chambers with water as the working fluid can be made by treating the graphite foam with an oxygen plasma to improve the wetting of the graphite by the water. Copyright © 2006 by ASME.

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ASME Journal of Electronic Packaging

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