Bonding technologies for chip level and wafer level 3D integration
- Katsuyuki Sakuma
- Spyridon Skordas
- et al.
- 2014
- ECTC 2014
Conference paper
Publications
17 results at ECTC 2014
Controlling the Sn grain morphology of SnAg C4 solder bumps
- Gregory Parks
- Minhua Lu
- et al.
- 2014
- ECTC 2014
Conference paperEffect of Ag and Cu content in Sn based Pb-free solder on electromigration
- Minhua Lu
- Charles Goldsmith
- et al.
- 2014
- ECTC 2014
Conference paperTime, temperature, and mechanical fatigue dependence on underfill adhesion
- Joseph Cremaldi
- Michael Gaynes
- et al.
- 2014
- ECTC 2014
Conference paperWafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
- Jae Woong Nah
- Jeffrey Gelorme
- et al.
- 2014
- ECTC 2014
Conference paperModeling of switching noise and coupling in multiple chips of 3D TSV-based systems
- Huanyu He
- Xiaoxiong Gu
- et al.
- 2014
- ECTC 2014
Conference paperA compact 4-chip package with 64 embedded dual-polarization antennas for W-band phased-array transceivers
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2014
- ECTC 2014
Conference paperWafer-level non conductive films for exascale servers
- Akihiro Horibe
- Sayuri Kohara
- et al.
- 2014
- ECTC 2014
Conference paperNanofiller based spin-on materials for negligible reflection of silicon photonic external coupling
- Yoichi Taira
- Ryuma Mizusawa
- et al.
- 2014
- ECTC 2014
Conference paperMulticore fiber 4 TX + 4 RX optical transceiver based on holey SiGe IC
- Fuad E. Doany
- Daniel M. Kuchta
- et al.
- 2014
- ECTC 2014
Conference paper