High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
We describe the advancements made on the automated assembly of a highly integrated 8x8 photonic switch. This switch is designed for maximum efficiency but requires proximity of optical and electrical interconnects and a well-conceived thermal solution. These constraints command innovative packaging approaches. A fiber-last assembly process was selected, which leverages a flip-chip joining solution to preserve the sensitive optical interfaces of the photonic circuit. A multi-fiber attach process relying on fiber self-alignment in V-grooves is used for the optical interface through which the high-speed signals are routed. It is also demonstrated that a performant optical switch engine can be constructed using standard low-cost electronic assembly principles.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Tymon Barwicz, Yoichi Taira, et al.
GFP 2015
Ilter Ozkaya, Alessandro Cevrero, et al.
IEEE JSSC
Clint L. Schow, Alexander V. Rylyakov, et al.
OFC 2011