Publication
ECTC 2020
Conference paper

Automated Assembly of High Port Count Silicon Photonic Switches

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Abstract

We describe the advancements made on the automated assembly of a highly integrated 8x8 photonic switch. This switch is designed for maximum efficiency but requires proximity of optical and electrical interconnects and a well-conceived thermal solution. These constraints command innovative packaging approaches. A fiber-last assembly process was selected, which leverages a flip-chip joining solution to preserve the sensitive optical interfaces of the photonic circuit. A multi-fiber attach process relying on fiber self-alignment in V-grooves is used for the optical interface through which the high-speed signals are routed. It is also demonstrated that a performant optical switch engine can be constructed using standard low-cost electronic assembly principles.

Date

01 Jun 2020

Publication

ECTC 2020

Authors

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