Publication
OFC 2017
Conference paper

High-throughput photonic packaging

Abstract

We have demonstrated photonic packaging compatible with standard, high-throughput. microelectronics assembly lines. We show a 1.3dB fiber-to-chip loss and 1.1dB chip-to-chip loss. We discuss the rationale behind this approach and compare to other packaging directions.

Date

31 May 2017

Publication

OFC 2017

Authors

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