About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
ESSCIRC 2014
Conference paper
A DDR3/4 memory link TX supporting 24-40 ω, 0.8-1.6 V, 0.8-5.0 Gb/s with slew rate control and thin oxide output stages in 22-nm CMOS SOI
Abstract
A transmitter for data (DQ) lines in a DDR3/4 memory link is presented. The transmitter supports a drive impedance range of 24-40 ω, operates from a 0.8-1.6 V supply range, and runs between 0.8 and 5.0 Gb/s. The DDR TX includes a clock-feathering-based slew rate control with duty cycle adjustment and uses thin oxide output stages for power saving. The power supply for the thin oxide pull-up protection is provided by an on-chip voltage regulator. Also FFE with 1 postcursor tap and max. 9.5 dB de-emphasis at 40 ω is included. Results measured with typical DDR settings such as 30 ω drive impedance and 1.35 V supply show a 1.2-5.8 V/ns slew rate range into a 50 ω termination, an energy efficiency at 2133 Mb/s of 4.4 pJ/bit and TJ (BER 10-12) of 26 ps. The transmitter is fabricated in 22-nm CMOS SOI and has a size of 132 × 83 μm2.