Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom O. Watanabe
- et al.
- 2023
- ECTC 2023
Publications
Date
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- Semiconductors
679 results for Semiconductors
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- Juliano Borges
- Maxime Darnon
- et al.
- 2023
- ECTC 2023
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023
Experimental Identification of the Failure Modes and Failure Mechanisms of Fiber to Waveguide Couplings Under Cyclic Tensile Loading
- Assane Dione
- Jean-Francois Morissette
- et al.
- 2023
- ECTC 2023
Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Silicon photonic co-packaging: Adhesive dispense challenge and control
- Paul Gond-Charton
- Sebastien Gouin
- et al.
- 2023
- ECTC 2023
Extracting Anisotropic Permittivity of PCB Substrate from VNA Measurement on a Rectangular Stripline Resonator Loaded with a Via Array
- Zhaoqing Chen
- Hung Nguyen
- et al.
- 2023
- ECTC 2023
An 8b 1.0-to-1.25GS/s 0.7-to-0.8V Single-Stage Time-Based Gated-Ring-Oscillator ADC with 2× Interpolating Sense-Amplifier-Latches
- Abdullah Serdar Yonar
- Pier Andrea Francese
- et al.
- 2023
- ISSCC 2023
Double spin-torque magnetic tunnel junction devices for last-level cache applications
- G. Hu
- C. Safranski
- et al.
- 2022
- IEDM 2022