Publication
SPIE Advanced Lithography + Patterning 2025
Conference paper
High resolution patterning of positive resist for semi-additive process
Abstract
This talk discusses the development and optimization of a high-resolution semi-additive process for RDL. We discuss our approach to obtain optimal resist sidewalls and fine lines on a contact aligner. Then we show the final plating results with little to no undercut post seed layer etch by using a novel wet etch.