Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2022
- ECTC 2022
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208 results for Hardware Technology
Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- Prabudhya Roy Chowdhury
- Katsuyuki Sakuma
- et al.
- 2022
- ECTC 2022
Deterministic Frequency Boost and Voltage Enhancements on the POWER10TM Processor
- Brian Vanderpool
- Phillip Restle
- et al.
- 2022
- ISSCC 2022
A 24-to-30GHz 256-Element Dual-Polarized 5G Phased Array with Fast Beam-Switching Support for >30,000 Beams
- Bodhisatwa Sadhu
- Arun Paidimarri
- et al.
- 2022
- ISSCC 2022
Development of spatial nearest-neighbor analysis and Clustering/Gibbs statistical methodology for filament percolation in dielectric breakdown and forming process in ReRAM devices
- Ernest Y Wu
- Franco Stellari
- et al.
- 2021
- IEDM 2021
Temperature sensitivity of analog in-memory computing using phase-change memory
- Irem Boybat-Kara
- Benedikt Kersting
- et al.
- 2021
- IEDM 2021
2X reduction of STT-MRAM switching current using double spin-torque magnetic tunnel junction
- Guohan Hu
- Jonathan Sun
- et al.
- 2021
- IEDM 2021
Optimizing AsSeGe Chalcogenides by Dopants for Extremely Low IOFF, High Endurance and Low Vth Drift 3D Crosspoint Memory
- Huai-Yu Cheng
- Wei-Chih Chien
- et al.
- 2021
- IEDM 2021