Tunable and Mass-fabrication Compatible All-dielectric Metasurfaces for Mobile Sensing Applications

Abstract

A novel approach to fabricate all-dielectric metasurfaces is presented that enables upscaling to mass-fabrication levels. Despite the excellent scalability, the feature sizes of the transferred devices are well below 5 nm, enabling the metasurface's high sensitivity to dielectric changes in their environment to be used as built-in spectral feature for sensing applications with simplified read-outs.