A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
- Sathya Raghavan
- Aakrati Jain
- et al.
- 2023
- ECTC 2023
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208 results for Hardware Technology
Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip
- Toyohiro Aoki
- Katsuyuki Sakuma
- et al.
- 2023
- ECTC 2023
Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- Juliano Borges
- Maxime Darnon
- et al.
- 2023
- ECTC 2023
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023
Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Extracting Anisotropic Permittivity of PCB Substrate from VNA Measurement on a Rectangular Stripline Resonator Loaded with a Via Array
- Zhaoqing Chen
- Hung Nguyen
- et al.
- 2023
- ECTC 2023
Double spin-torque magnetic tunnel junction devices for last-level cache applications
- G. Hu
- C. Safranski
- et al.
- 2022
- IEDM 2022
Cryogenic InGaAs HEMT-Based Switches For Quantum Signal Routing
- 2022
- IEDM 2022
On the Write Schemes and Efficiency of FeFET 1T NOR Array for Embedded Nonvolatile Memory and Beyond
- Yi Xiao
- Yixin Xu
- et al.
- 2022
- IEDM 2022