AFM Assisted Hybrid Bonding Interface Optimization
- Nick Polomoff
- Jennifer Fullam
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Publications
238 results for Hardware Technology
Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- Luciana Meli
- Indira Seshadri
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
High resolution patterning of positive resist for semi-additive process
- Elizabeth A. Duch
- Minhua Lu
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Dry Resist Characterization Towards Technology Insertion for 28-36P EUV Patterning
- Yasiel Cabrera
- Gopal Kenath
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
A 6.78MHz Single-Stage Regulating Rectifier with Dual Outputs Simultaneously Charged in a Half Cycle Achieving 92.2%-Efficiency and 131mW Output Power
- Quanrong Zhuang
- Junyi Sun
- et al.
- 2025
- ISSCC 2025
A 353mW 112Gb/s Discrete Multitone Wireline Receiver Datapath with Time-Based ADC in 5nm FinFET
- Jaewon Lee
- Pier Andrea Francese
- et al.
- 2025
- ISSCC 2025
Dynamic Guard-Band Features of the IBM zNext System
- Tobias Webel
- Phillip Restle
- et al.
- 2025
- ISSCC 2025
A DAC-Based Discrete Multitone Wireline Transmitter in 5nm FinFET
- Seoyoung Jang
- Marcel Kossel
- et al.
- 2025
- ISSCC 2025
The Viability of HFO-1234ze(E) (trans-1,3,3,3-Tetrafluoropropene) as a Low Global Warming Potential Silicon Dioxide Etch Gas
- Aaron Windsor
- Jeremy Clark
- et al.
- 2025
- JVSTB
Multi-Task Neural Network Mapping onto Analog-Digital Heterogeneous Accelerators
- 2024
- NeurIPS 2024