Solder Injected through Via for Multi Stacked Wafers
- Akihiro Horibe
- Kuniaki Sueoka
- et al.
- 2016
- ECTC 2016
Publications
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
Proposal of Package Structure Requirements for Effective Cooling from the Bottom Side of Chips (from the Substrate Side), Aiming for a Three-Dimensional (3D) Chip Stack
- Keiji Matsumoto
- Hiroyuki Mori
- 2016
- ECTC 2016
Fluxless Bonding Process Using Thermo-Compression Micro-Scrub for 61 μm Pitch SnAg Solder 3-D Interconnections
- Katsuyuki Sakuma
- Bucknell Webb
- et al.
- 2016
- ECTC 2016
An Endpoint Communication Profiling Tool for Distributed Computing Frameworks
- Andrea Rosá
- Lydia Y. Chen
- et al.
- 2016
- ICDCS 2016
BotMeter: Charting DGA-Botnet Landscapes in Large Networks
- Ting Wang
- Xin Hu
- et al.
- 2016
- ICDCS 2016
On the Efficiency of Decentralized Search in Expert Networks
- Liang Ma
- Mudhakar Srivatsa
- et al.
- 2016
- ICDCS 2016
Exploiting Causality to Engineer Elastic Distributed Software
- Jayaram Kr Kallapalayam Radhakrishnan
- 2016
- ICDCS 2016
Dslash: Managing Data in Overloaded Batch Streaming Systems
- Robert Birke
- Mathias Bjorkqvist
- et al.
- 2016
- ICDCS 2016
Cognitive Technologies for Smarter Cities
- Martin G. Kienzle
- 2016
- ICDCS 2016