McGan: Mean and covariance feature matching GAN
- Youssef Mroueh
- Tom Sercu
- et al.
- 2017
- ICML 2017
Publications
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Bidirectional learning for time-series models with hidden units
- Takayuki Osogami
- Hiroshi Kajino
- et al.
- 2017
- ICML 2017
Creation and interaction with large-scale domain-specific knowledge bases
- S. Bharadwaj
- Laura Chiticariu
- et al.
- 2017
- VLDB 2017
Tutorial: Blockchains and databases
- C. Mohan
- 2017
- VLDB 2017
Foresight: Recommending visual insights
- Cagatay Demiralp
- Peter J. Haas
- et al.
- 2017
- VLDB 2017
Optoelectronic Chip Assembly Process of Optical MCM
- Masao Tokunari
- Koji Masuda
- et al.
- 2017
- ECTC 2017
Novel, High-Throughput, Fiber-to-Chip Assembly Employing only Off-the-Shelf Components
- Nicolas Boyer
- Alexander Janta-Polczynski
- et al.
- 2017
- ECTC 2017
Thermo-Compression Bonding and Mass Reflow Assembly Processes of 3D Logic Die Stacks
- Pascale Gagnon
- Christian Bergeron
- et al.
- 2017
- ECTC 2017
Morphology of Low-Temperature All-Copper Interconnects Formed by Dip Transfer
- Luca Del Carro
- Jonas Zuercher
- et al.
- 2017
- ECTC 2017
Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly
- Yves Martin
- Swetha Kamlapurkar
- et al.
- 2017
- ECTC 2017