Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- Mark D. Schultz
- Cyril Cabral
- et al.
- 2018
- ECTC 2018
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Backward compatible connectors for next generation PCIe electrical I/O
- Lei Shan
- Daniel Freidman
- et al.
- 2018
- ECTC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- John Knickerbocker
- Russell A. Budd
- et al.
- 2018
- ECTC 2018
Injection of Molten Solder (IMS) Technology for Solder Bumping on Wafers, Ceramic/Organic/Flexible Substrates, and Si Via Filling from Fine Pitch to Large Pitch
- Jae Woong Nah
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
2D magnetic inductors for DC-DC converters on glass interposer
- Vincent Lafage
- Yann Beilliard
- et al.
- 2018
- ECTC 2018
Solder-Reflowable, High-Throughput Fiber Assembly Achieved by Partitioning of Adhesive Functions
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2018
- ECTC 2018
Charm: A language for closed-form high-level architecture modeling
- Weilong Cui
- Yongshan Ding
- et al.
- 2018
- ISCA 2018
PROMISE: An end-to-End design of a programmable mixed-Signal accelerator for Machine-Learning algorithms
- Prakalp Srivastava
- Mingu Kang
- et al.
- 2018
- ISCA 2018
Efficient shared memory orchestration towards demand driven memory slicing
- Qi Zhang
- Ling Liu
- et al.
- 2018
- ICDCS 2018
It's hard to share: Joint service placement and request scheduling in edge clouds with sharable and non-sharable resources
- Ting He
- Hana Khamfroush
- et al.
- 2018
- ICDCS 2018