Network Aware Container Orchestration for Telco Workloads
- Kavya Govindarajan
- Chander Govindarajan
- et al.
- 2022
- CLOUD 2022
Publications
Compliance-as-Code for Cybersecurity Automation in Hybrid Cloud
- Vikas Agarwal
- Chris Butler
- et al.
- 2022
- CLOUD 2022
Detecting Layered Bottlenecks in Microservices
- Tatsushi Inagaki
- Yohei Ueda
- et al.
- 2022
- CLOUD 2022
Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge
- Keiji Matsumoto
- Marc Bergendahl
- et al.
- 2021
- ECTC 2021
Novel Phased Array Antenna-in-Package Development and Active Module Demonstration for 5G Millimeter-Wave Wireless Communication
- Xiaoxiong Gu
- Duixian Liu
- et al.
- 2021
- ECTC 2021
Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- Kamal Sikka
- Ravi Bonam
- et al.
- 2021
- ECTC 2021
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
- Katsuyuki Sakuma
- Dishit Parekh
- et al.
- 2021
- ECTC 2021
High Density Multi-Chip Module for Photonic Reservoir Computing
- Jean Benoit Heroux
- Toshiyuki Yamane
- et al.
- 2021
- ECTC 2021
CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration
- Risa Miyazawa
- Chinami Marushima
- et al.
- 2021
- ECTC 2021
Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
- Aakrati Jain
- Kamal Sikka
- et al.
- 2021
- ECTC 2021