Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022
Publications
Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)
- Keiji Matsumoto
- Takahito Watanabe
- et al.
- 2022
- ECTC 2022
Sine Series Approximation of the Mod Function for Bootstrapping of Approximate HE
- Charanjit Jutla
- Nathan Manohar
- 2022
- Eurocrypt 2022
Group Signatures and More from Isogenies and Lattices: Generic, Simple, and Efficient
- Ward Beullens
- Samuel Dobson
- et al.
- 2022
- Eurocrypt 2022
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications
- Aakrati Jain
- Kamal Sikka
- et al.
- 2022
- ECTC 2022
Super Fine Jet Underfill Dispense Technique for Robust Micro Joint in Direct Bonded Heterogeneous Integration (DBHi) Silicon Bridge Packages
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2022
- ECTC 2022
Zero-Knowledge IOPs with Linear-Time Prover and Polylogarithmic-Time Verifier
- Jonathan Bootle
- Alessandro Chiesa
- et al.
- 2022
- Eurocrypt 2022
Cluster & Tune: Boost Cold Start Performance in Text Classification
- Eyal Shnarch
- Ariel Gera
- et al.
- 2022
- ACL 2022
Towards Learning (Dis)-Similarity of Source Code from Program Contrasts
- Yangruibo Ding
- Luca Buratti
- et al.
- 2022
- ACL 2022