Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- Minhua Lu
- Evan Colgan
- 2024
- ECTC 2024
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67 results for Evan Colgan
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- Qianwen Chen
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- John Knickerbocker
- Russell A. Budd
- et al.
- 2018
- ECTC 2018
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
200 mm wafer-scale integration of sub-20 nm sacrificial nanofluidic channels for manipulating and imaging single DNA molecules
- C. Wang
- S.W. Nam
- et al.
- 2013
- IEDM 2013
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Direct integration of dense parallel optical interconnects on a first level package for high-end servers
- Evan G. Colgan
- Bruce Furman
- et al.
- 2005
- ECTC 2005
High conductivity gate metallurgy for TFT/LCD's
- P.M. Fryer
- E.G. Colgan
- et al.
- 1998
- MRS Spring Meeting 1998
High conductivity gate metallurgy for TFT/LCD's
- P.M. Fryer
- E.G. Colgan
- et al.
- 1998
- MRS Spring Meeting 1998