Co-Design of 300 mm Wafer Scale Package
- Kai Schleupen
- Evan Colgan
- et al.
- 2024
- ITherm 2024
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67 results for Evan Colgan
Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- Minhua Lu
- Evan Colgan
- 2024
- ECTC 2024
Thermal Design & Performance of 300 mm Wafer Scale System
- Evan G. Colgan
- Phillip Mann
- et al.
- 2024
- ITherm 2024
Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler
- Evan G. Colgan
- Kai Schleupen
- et al.
- 2023
- IEEE Transactions on CPMT
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- John Knickerbocker
- Russell A. Budd
- et al.
- 2018
- ECTC 2018
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- Qianwen Chen
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Modeling embedded two-phase liquid cooled high power 3D compatible electronic devices
- Pritish R. Parida
- Arvind Sridhar
- et al.
- 2017
- SEMI-THERM 2017
Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules
- Chao Wang
- Sung Wook Nam
- et al.
- 2017
- Nature Communications
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
Boiling sensitivity analysis of asymmetrically heated micro-scale devices
- Fanghao Yang
- Mark D. Schultz
- et al.
- 2016
- ITherm 2016