This paper proposed a high-speed precision handling technology of micro-chip using programmable laser debonding technology for fan-out wafer level packaging (FOWLP) application, and investigated the programmable capability, the speed and the accuracy with laser debonding experiments on chips down to 25umX25um. The proposed FOWLP approach has features of: (a) all steps are based on wafer-level processes by using programmable laser debonding technology to achieve the reconstituted wafer, enabling high-speed precision hanldinghandling technology for micro-chip. And, (b) two bonding interface layers, one high-strength adhesive layer for chips firmly joined to handler and the other UV-sensitive layer for easily laser debonding, can improve the die-shift issues. The successfully debonding results, including selectively debonding 200umX400um chips from handler wafer and specifically debonding 25umX25um chips forming the letters 'IBM', indicates the programmable capability of this technology. The experiment results show that the debonding speed can be up to 360,000 components per hour (cph), and the debonding accuracy can be in the microns range.