Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging
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154 results for Thomas Brunschwiler
Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal
- Thomas Brunschwiler
- Arvind Sridhar
- et al.
- 2016
- ASME Journal of Electronic Packaging
Lid-integral cold-plate topology: Integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2016
- ASME Journal of Electronic Packaging
Steady-state low thermal resistance characterization apparatus: The bulk thermal tester
- Brian R. Burg
- Manuel Kolly
- et al.
- 2015
- Review of Scientific Instruments
A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
- Chander Shekhar Sharma
- Gerd Schlottig
- et al.
- 2015
- Int. J. Heat Mass Transf.
Energy efficient hotspot-targeted embedded liquid cooling of electronics
- Chander Shekhar Sharma
- Manish K. Tiwari
- et al.
- 2015
- Applied Energy
In situ assembly in confined spaces of coated particle scaffolds as thermal underfills with extraordinary thermal conductivity
- Guo Hong
- Thomas M. Schutzius
- et al.
- 2014
- ACS AMI
Computational modeling of vortex shedding in water cooling of 3D integrated electronics
- Fabio Alfieri
- Manish K. Tiwari
- et al.
- 2013
- International Journal of Heat and Fluid Flow
Computational modeling of hot-spot identification and control in 3-D stacked chips with integrated cooling
- Fabio Alfieri
- Sacha Gianini
- et al.
- 2013
- Numerical Heat Transfer; Part A: Applications
Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks
- Adrian Renfer
- Manish K. Tiwari
- et al.
- 2013
- Int. J. Heat Mass Transf.