Direct waste heat utilization from liquid-cooled supercomputersThomas BrunschwilerGerhard Ingmar Meijeret al.2010IHTC 2010
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid coolingArvind SridharAlessandro Viricenziet al.2010ICCAD 2010
Heat-removal performance scaling of interlayer cooled chip stacksThomas BrunschwilerStephan Paredeset al.2010ITherm 2010
Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chipsW. EscherThomas Brunschwileret al.2010Journal of Heat Transfer
Self-contained, oscillating flow liquid cooling system for thin form factor high performance electronicsR. WälchliThomas Brunschwileret al.2010Journal of Heat Transfer
Energy-efficient variable-flow liquid cooling in 3D stacked architecturesAyse K. CoskunDavid Atienzaet al.2010DATE 2010
Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling designR. WälchliThomas Brunschwileret al.2010Int. J. Heat Mass Transf.
Hotspot-adapted cold plates to maximize system efficiencyThomas BrunschwilerHugo Rothuizenet al.2009THERMINIC 2009
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacksT. BrunschwilerS. Paredeset al.20093DIC 2009