Electromigration of Cu/low dielectric constant interconnects
- C.-K. Hu
- L. Gignac
- et al.
- 2006
- Microelectronics Reliability
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144 results for Lynne Gignac
Effect of metal liner on electromigration in Cu Damascene lines
- C.-K. Hu
- L. Gignac
- et al.
- 2005
- Journal of Applied Physics
Tungsten oxide nanowire growth by chemically induced strain
- Christian Klinke
- James B. Hannon
- et al.
- 2005
- Journal of Physical Chemistry B
Imaging and analysis of subsurface Cu interconnects by detecting backscattered electrons in the scanning electron microscope
- L. Gignac
- M. Kawasaki
- et al.
- 2005
- Journal of Applied Physics
Top-down topography of deeply etched silicon in the scanning electron microscope
- Oliver C. Wells
- Conal E. Murray
- et al.
- 2004
- Review of Scientific Instruments
Atom motion of Cu and Co in Cu damascene lines with a CoWP cap
- C.-K. Hu
- L. Gignac
- et al.
- 2004
- Applied Physics Letters
Effects of failure criteria on the lifetime distribution of dual-damascene Cu line/via on W
- R.F. Liu
- C.-K. Hu
- et al.
- 2004
- Journal of Applied Physics
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters
Effect of liner thickness on electromigration lifetime
- E. Liniger
- C.-K. Hu
- et al.
- 2003
- Journal of Applied Physics
Evaluations and considerations for self-assembled monolayer field-effect transistors
- C.R. Kagan
- A. Afzali
- et al.
- 2002
- Nano Letters