Publications

41 results for F. Chen

Line edge roughness and spacing effect on low-k TDDB characteristics
- - F. Chen
  - J.R. Lloyd
  - et al.
- 2008
- IRPS 2008
Reliability of Cu interconnects with Ta implant
- - J.P. Gambino
  - T.D. Sullivan
  - et al.
- 2007
- IITC 2007
Improved electromigration lifetime for copper interconnects using tantalum implant
- - Jeff Gambino
  - Timothy D. Sullivan
  - et al.
- 2007
- MRS Spring Meeting 2007
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- - S. Sankaran
  - S. Arai
  - et al.
- 2006
- IEDM 2006
A comprehensive study of low-k SiCOH TDDB phenomena and its reliability lifetime model development
- - F. Chen
  - O. Bravo
  - et al.
- 2006
- IRPS 2006
65nm Cu integration and interconnect reliability in low stress K=2.75 SiCOH
- - V. McGahay
  - G. Bonilla
  - et al.
- 2006
- IITC 2006
BEOL process integration with Cu/SiCOH (k=2.8) low-k interconnects at 65nm groundrules
- - S. Lane
  - M. Fukasawa
  - et al.
- 2005
- AMC 2005
A SiCOH BEOL interconnect technology for high density and high performance 65 nm CMOS applications
- - Matthew Angyal
  - Jason Gill
  - et al.
- 2005
- AMC 2005
PECVD Low-k (∼2.7) dielectric SiCOH film development and integration for 65 nm CMOS devices
- - K. Ida
  - S. Nguyen
  - et al.
- 2005
- AMC 2005
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures
- - F. Chen
  - J. Gill
  - et al.
- 2006
- Microelectronics Reliability