Electrical assessment of chip to chip connection for ultra high density organic interposer
- Keishi Okamoto
- Hiroyuki Mori
- et al.
- 2014
- ICEP 2014
Publications
21 results for Keishi Okamoto
Electrical capability assessment for high wiring density organic interposer
- Keishi Okamoto
- Hiroyuki Mori
- et al.
- 2013
- EDAPS 2013
Electrical characterization of low-cost glass/epoxy laminates at millimeter wave frequencies
- Noam Kaminski
- Evgeny Shumakher
- et al.
- 2013
- EPEPS 2013
Thermally enhanced pre-applied underfills for 3D integration
- Akihiro Horibe
- Keishi Okamoto
- et al.
- 2013
- ECTC 2013
No Clean Flux technology for large die flip chip packages
- Akihiro Horibe
- Kang-Wook Lee
- et al.
- 2013
- ECTC 2013
Effect of preformed IMC layer on electromigration of solder capped cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- IMAPS 2012
Joint reliability study of solder capped metal pillar bump interconnections on an organic substrate
- Kazushige Toriyama
- Yasushi Takeoka
- et al.
- 2012
- ICSJ 2012
Effect of preformed Cu-Sn IMC layer on electromigration reliability of solder capped Cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- ICSJ 2012
Effect of preformed IMC layer on electromigration of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMPACT 2011
Microstructure observation of electromigration behavior in peripheral C2 flip chip interconnection with solder capped Cu pillar bump
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2011
- IMAPS 2011