Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
We introduce a planar, triple-self-aligned double-gate FET structure ("PAGODA"). Device fabrication incorporates wafer bonding, front-end CMP, mixed optical/ebeam lithography, silicided silicon source/drain sidewalls, and back gate undercut and passivation. We demonstrate double-gate FET operation with good transport at both interfaces, inverter action, and NOR logic.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.
J.V. Harzer, B. Hillebrands, et al.
Journal of Magnetism and Magnetic Materials
Surendra B. Anantharaman, Joachim Kohlbrecher, et al.
MRS Fall Meeting 2020