William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
We introduce a planar, triple-self-aligned double-gate FET structure ("PAGODA"). Device fabrication incorporates wafer bonding, front-end CMP, mixed optical/ebeam lithography, silicided silicon source/drain sidewalls, and back gate undercut and passivation. We demonstrate double-gate FET operation with good transport at both interfaces, inverter action, and NOR logic.
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010
R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids
Imran Nasim, Melanie Weber
SCML 2024
J.K. Gimzewski, T.A. Jung, et al.
Surface Science