Diffusion and Defect Data Pt.B: Solid State Phenomena
Conference paper

New aqueous clean for aluminum interconnects: Part II. Applications


The integration of a new aqueous clean, dSP+, has been demonstrated for aluminum interconnect technology in advanced DRAM products. The dSP+ chemistry was targeted for two back-end-of-line (BEOL) applications: post Al RIE clean and via clean. The results in this paper are discussed using SEM, reliability, and electrical parametric data.