Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
The integration of a new aqueous clean, dSP+, has been demonstrated for aluminum interconnect technology in advanced DRAM products. The dSP+ chemistry was targeted for two back-end-of-line (BEOL) applications: post Al RIE clean and via clean. The results in this paper are discussed using SEM, reliability, and electrical parametric data.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009
S. Cohen, J.C. Liu, et al.
MRS Spring Meeting 1999
Thomas E. Karis, C. Mark Seymour, et al.
Rheologica Acta