New aqueous clean for aluminum interconnects: Part I. Fundamentals
- D.L. Rath
- R. Ravikumar
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena
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3 results for R. Ravikumar
New aqueous clean for aluminum interconnects: Part II. Applications
- R. Ravikumar
- D.L. Rath
- et al.
- 2000
- Diffusion and Defect Data Pt.B: Solid State Phenomena
Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films