Conference paper
REACTIVE ION ETCHING OF Al(Cu) ALLOYS.
C.-K. Hu, M.B. Small, et al.
MRS Fall Meeting 1986
A study was performed on the effect of liner thickness on electromigration lifetime. The measurement of electromigration lifetime, as a function of liner thickness for Cu/SiO2 interconnect structures was performed. Results showed a significant increase in mean lifetime for structures in which the liner thickness at the base of the test via was less than approximately 6 nm, with a current density<5mA/μm2 in the power line connected to the test via.
C.-K. Hu, M.B. Small, et al.
MRS Fall Meeting 1986
C.-K. Hu, L. Gignac, et al.
ECS Meeting 2006
C.-K. Hu, L. Gignac, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2007
C.-K. Hu, L. Gignac, et al.
Applied Physics Letters