Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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Year

15 results for E. Liniger

Reliability challenges for the 10nm node and beyond
- - James Stathis
  - Miaomiao Wang
  - et al.
- 2014
- IEDM 2014
Novel low k Dielectric materials for nano device interconnect technology
- - Son Van Nguyen
  - H. Shobha
  - et al.
- 2020
- VLSI-TSA 2020
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- - C. J. Penny
  - S. Gates
  - et al.
- 2017
- IITC 2017
Low hydrogen silicon carbon nitride cap for high performance sub-10 nm Cu-low k interconnect
- - Son Van Nguyen
  - Shobha Hosadugra
  - et al.
- 2017
- ECS Meeting 2017 - New Orleans
Effect of H₂O on TDDB for a range of ULK ILD materials with varying damage resistance for robust and weak liners
- - E. Liniger
  - R. Laibowitz
  - et al.
- 2016
- IRPS 2016
Towards an appropriate acceleration model for beol tddb
- - R. Muralidhar
  - E. Liniger
  - et al.
- 2016
- IRPS 2016
Experimental study of nanoscale Co damascene BEOL interconnect structures
- - J. Kelly
  - James H.-C. Chen
  - et al.
- 2016
- IITC/AMC 2016
Post porosity plasma protection integration at 48 nm pitch
- - H. Huang
  - Krystelle Lionti
  - et al.
- 2016
- IITC/AMC 2016
Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects
- - D. Priyadarshini
  - Son Van Nguyen
  - et al.
- 2016
- IITC/AMC 2016
Pre-liner dielectric nitridation for resistance reduction in copper interconnects
- - C. C. Yang
  - Terry A. Spooner
  - et al.
- 2016
- IITC/AMC 2016