A. Deutsch, G.V. Kopcsay, et al.
ECTC 1997
This paper compares the major classes of chip-to-chip and on-chips interconnections used in high-performance computers and communication systems. Measurement of dielectric loss is shown and the attenuation is compared for printed-circuit-board, glass-ceramic, thin-film, and on-chip wiring. Simulation results are shown with representative driver and receiver circuits, guidelines are formulated for when losses are significant, and predictions are made for the sustainable brandwidths on useful wiring lengths.
A. Deutsch, G.V. Kopcsay, et al.
ECTC 1997
G. Almasi, G. Almasi, et al.
ISSCC 2002
G. Arjavalingam, W. Robertson, et al.
IEE/LEOS Summer Topical Meetings 1991
J.D. Morsey, L. Jiang, et al.
ECTC 2008