R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
The three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structures with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagation to lifetime projections. © 2006.
R.M. Macfarlane, R.L. Cone
Physical Review B - CMMP
T. Schneider, E. Stoll
Physical Review B
Frank Stem
C R C Critical Reviews in Solid State Sciences
J.K. Gimzewski, T.A. Jung, et al.
Surface Science