Conference paper
True 3-D displays for avionics and mission crewstations
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
The three-parameter lognormal distribution has been demonstrated for applications in electromigration data analysis, especially for Cu interconnect structures with insufficient redundancy. Examples are given on estimating parameter values from experimental data using the maximum likelihood method. Detailed analyses are presented on confidence bound estimations of the parameters and their propagation to lifetime projections. © 2006.
Elizabeth A. Sholler, Frederick M. Meyer, et al.
SPIE AeroSense 1997
Sang-Min Park, Mark P. Stoykovich, et al.
Advanced Materials
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings
H.D. Dulman, R.H. Pantell, et al.
Physical Review B