First-Principles Investigations of TiGe/Ge Interface and Recipes to Reduce the Contact Resistance
- H. Dixit
- Chengyu Niu
- et al.
- 2017
- IEEE T-ED
Nick earned a B.S. in physics from Syracuse University and a Ph.D. in physics from Rensselaer Polytechnic Institute (RPI) in Troy, NY. He joined IBM in 2016 as part of the back-end-of-line (BEOL) integration team and currently works on leading edge technology development with a focus on design-technology co-optimization (DTCO.) Nick was named an IBM Master Inventor in 2020 and again in 2023. He currently serves on the committee for the IEEE International Interconnect Technology Conference.