Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process
- 2022
- ECTC 2022
Publications
This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
81 results for Hardware Technology
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
- 2022
- ECTC 2022
Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package
- 2022
- ECTC 2022
Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- 2022
- ECTC 2022
Characterization of Non-Conductive Paste Materials (NCP) for Thermocompression Bonding in a Direct Bonded Heterogeneously Integrated (DBHi) Si- Bridge Package
- 2022
- ECTC 2022
Deterministic Frequency Boost and Voltage Enhancements on the POWER10TM Processor
- 2022
- ISSCC 2022
A 24-to-30GHz 256-Element Dual-Polarized 5G Phased Array with Fast Beam-Switching Support for >30,000 Beams
- 2022
- ISSCC 2022
Critical Elements for Next Generation High Performance Computing Nanosheet Technology
- 2021
- IEDM 2021
Gate-Last IO Transistors based on Stacked Gate-All-Around Nanosheet Architecture for Advanced Logic Technologies
- 2021
- IEDM 2021
Development of spatial nearest-neighbor analysis and Clustering/Gibbs statistical methodology for filament percolation in dielectric breakdown and forming process in ReRAM devices
- 2021
- IEDM 2021