A 400-ns-Settling Time Hybrid Dynamic Voltage Frequency Scaling Architecture and Its Application in a 22-Core Network-on-Chip SoC in 12-nm FinFET Technology
- Erik Loscalzo
- Martin Cochet
- et al.
- 2024
- VLSI Technology and Circuits 2024
Publications
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
Reliable Chiplet Integration on High Density Laminate (2.X D) for AI Hardware
- Divya Taneja
- Jonathan Grenier
- et al.
- 2024
- ECTC 2024
Laser Attach Process Development and material selection
- Alexander Janta-Polczynski
- Elaine Cyr
- et al.
- 2024
- ECTC 2024
A Microstructural Investigation of Sub-1 μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
- Sari Zerey
- Junghyun Cho
- et al.
- 2024
- ECTC 2024
Ultra-Compact Computing at the Edge Involving Unobtrusively Small Sub-millimeter Heterogeneous Integration Packaging
- Frank Libsch
- Steve Bedell
- et al.
- 2024
- ECTC 2024
Electromigration Kinetics of SAC/SnBiAg Hybrid Solder
- Minhua Lu
- Evan Colgan
- 2024
- ECTC 2024
Witness Semantic Security
- Paul Lou
- Nathan Manohar
- et al.
- 2024
- Eurocrypt 2024
Taming subnet-drift in D2D-enabled fog learning: a hierarchical gradient tracking approach
- Evan Chen
- Shiqiang Wang
- et al.
- 2024
- INFOCOM 2024
Understanding and Bridging the Gap Between Unsupervised Network Representation Learning and Security Analytics
- Jiacen Xu
- Xiaokui Shu
- et al.
- 2024
- S&P 2024