Accelerating High NA EUV Lithography Insertion for Interconnect Scaling and Beyond: Performance, Cost, and Future Prospects
- Luciana Meli
- Indira Seshadri
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Publications
Metrology-Design Co-Optimization for BEOL dimensional characterization using scatterometry
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
Evaluating Novel Material Stacks Towards Gate Width Roughness Reduction
- Gopal Kenath
- Martin Burkhardt
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
A 6.78MHz Single-Stage Regulating Rectifier with Dual Outputs Simultaneously Charged in a Half Cycle Achieving 92.2%-Efficiency and 131mW Output Power
- Quanrong Zhuang
- Junyi Sun
- et al.
- 2025
- ISSCC 2025
IBM Telum II Processor Design-Technology Co-Optimizations for Power, Performance, Area and Reliability
- David Wolpert
- Gerry Strevig
- et al.
- 2025
- ISSCC 2025
IBM Telum II: Next Generation 5.5GHz Microprocessor with On-Die Data Processing Unit and Improved AI Accelerator
- Gerry Strevig
- Chris Berry
- et al.
- 2025
- ISSCC 2025
A 353mW 112Gb/s Discrete Multitone Wireline Receiver Datapath with Time-Based ADC in 5nm FinFET
- Jaewon Lee
- Pier Andrea Francese
- et al.
- 2025
- ISSCC 2025
Dynamic Guard-Band Features of the IBM zNext System
- Tobias Webel
- Phillip Restle
- et al.
- 2025
- ISSCC 2025
WikiContradict: A Benchmark for Evaluating LLMs on Real-World Knowledge Conflicts from Wikipedia
- Yufang Hou
- Alessandra Pascale
- et al.
- 2024
- NeurIPS 2024
A TWO-SCALE COMPLEXITY MEASURE FOR DEEP LEARNING MODELS
- Massimiliano Datres
- Gian Paolo Leonardi
- et al.
- 2024
- NeurIPS 2024