Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Publications
Date
Featured collections
Popular topics
Terabit/sec-class board-level optical interconnects through polymer waveguides using 24-channel bidirectional transceiver modules
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2011
- ECTC 2011
Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
- Fengda Sun
- Yusuf Leblebici
- et al.
- 2011
- ECTC 2011
Low-profile 3D silicon-on-silicon multi-chip assembly
- Paul Andry
- Bing Dang
- et al.
- 2011
- ECTC 2011
High-bandwidth density optical I/O for high-speed logic chip on waveguide-integrated organic carrier
- Masao Tokunari
- Yutaka Tsukada
- et al.
- 2011
- ECTC 2011
Using MATCON to generate CASE tools that guide deployment of pre-packaged applications
- Elad Fein
- Natalia Razinkov
- et al.
- 2011
- ICSE 2011
A framework for automated testing of JavaScript web applications
- Shay Artzi
- Julian Dolby
- et al.
- 2011
- ICSE 2011
Refactoring Java programs for flexible locking
- Max Schäfer
- Manu Sridharan
- et al.
- 2011
- ICSE 2011
Blending freeform and managed information in tables (NIER track)
- Nicolas Mangano
- Harold Ossher
- et al.
- 2011
- ICSE 2011
Code coverage analysis in practice for large systems
- Yoram Adler
- Noam Behar
- et al.
- 2011
- ICSE 2011