Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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13 results for S. Siddiqui

A comparative study of strain and Ge content in Si_1-xGe_x channel using planar FETs, FinFETs, and strained relaxed buffer layer FinFETs
- - Choonghyun Lee
  - S. Mochizuki
  - et al.
- 2017
- IEDM 2017
Technology viable DC performance elements for Si/SiGe channel CMOS FinFTT
- - G. Tsutsui
  - Ruqiang Bao
  - et al.
- 2016
- IEDM 2016
A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
- - Ruilong Xie
  - Pietro Montanini
  - et al.
- 2016
- IEDM 2016
Selective GeO_x-scavenging from interfacial layer on Si_1-xGe_x channel for high mobility Si/Si_1-xGe_x CMOS application
- - Choonghyun Lee
  - H. Kim
  - et al.
- 2016
- VLSI Technology 2016
High performance 14nm SOI FinFET CMOS technology with 0.0174μm² embedded DRAM and 15 levels of Cu metallization
- - C.-H.C-H. Lin
  - B. Greene
  - et al.
- 2014
- IEDM 2014
Future on-chip interconnect metallization and electromigration
- - C. K. Hu‬
  - J. Kelly
  - et al.
- 2018
- IRPS 2018
Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires
- - C. K. Hu‬
  - J. Kelly
  - et al.
- 2017
- IITC 2017
Experimental study of nanoscale Co damascene BEOL interconnect structures
- - J. Kelly
  - James H.-C. Chen
  - et al.
- 2016
- IITC/AMC 2016
BEOL process integration for the 7 nm technology node
- - T. Standaert
  - Genevieve Beique
  - et al.
- 2016
- IITC/AMC 2016
Tungsten and cobalt metallization: A material study for MOL local interconnects
- - Vimal Kamineni
  - Mark Raymond
  - et al.
- 2016
- IITC/AMC 2016