Copper contact metallization for 22 nm and beyond
- Soon-Cheon Seo
- Chih-Chao Yang
- et al.
- 2009
- IITC 2009
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15 results for Dave Horak
Overcoming the challenges of 22-nm node patterning through litho-design co-optimization
- Martin Burkharde
- J.C. Arnold
- et al.
- 2009
- SPIE Advanced Lithography 2009
A multilevel copper/low-k/airgap BEOL technology
- S.V. Nitta
- S. Ponoth
- et al.
- 2007
- ADMETA 2007
Trimming of hard-masks by gaseous chemical oxide removal (COR) for sub-10nm gates/fins, for gate length control and for embedded logic
- Wesley C. Natzle
- David Horak
- et al.
- 2004
- ASMC 2004
Thermal stability of copper contact metallization using Ru-containing liner
- Soon-Cheon Seo
- C.-C. Yang
- et al.
- 2011
- Electrochemical and Solid-State Letters