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Methodology of ALD HfO2 high-κ gate dielectric optimization by cyclic depositions and annealsH. JagannathanRobert D. Clarket al.2010ECS Transactions
Fully depleted extremely thin SOI technology fabricated by a novel integration scheme featuring implant-free, zero-silicon-loss, and faceted raised source/drainK. ChengA. Khakifiroozet al.2009VLSI Technology 2009
Extremely scaled gate-first high-k/metal gate stack with EOT of 0.55 nm using novel interfacial layer scavenging techniques for 22nm technology node and beyondK. ChoiH. Jagannathanet al.2009VLSI Technology 2009
Engineering band-edge high-κ/metal gate n-MOSFETs with cap layers containing group IIA and IIIB elements by atomic layer depositionH. JagannathanL.F. Edgeet al.2009ECS Meeting 2009
High-K gate dielectric structures by atomic layer deposition for the 32nm and beyond nodesR.D. ClarkS. Consiglioet al.2008ECS Meeting 2008
Process and electrical characteristics of MO-ALD HfO2 films for high-K gate applications grown in a production-worthy 300 mm deposition systemR.D. ClarkC.S. Wajdaet al.2007ECS Meeting 2007
Band-edge high-performance high-κ /metal gate n-MOSFETs using cap layers containing group IIA and IIIB elements with gate-first processing for 45 nm and beyondV. NarayananV.K. Paruchuriet al.2006VLSI Technology 2006
Poly-Si/AlN/HfSiO stack for ideal threshold voltage and mobility in sub-100 nm MOSFETsK.-L. LeeM.M. Franket al.2006VLSI Technology 2006
HfO 2/metal stacks: Determination of energy level diagram, work functions & their dependence on metal depositionS. ZafarV. Narayananet al.2005VLSI Technology 2005