Critical ultra low-k TDDB reliability issues for advanced CMOS technologies
- F. Chen
- M. Shinosky
- et al.
- 2009
- IRPS 2009
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13 results for Craig Child
Electron scattering at interfaces in nano-scale vertical interconnects: A combined experimental and ab initio study
- Nicholas A. Lanzillo
- Oscar D. Restrepo
- et al.
- 2018
- Applied Physics Letters
Competitive and cost effective copper/low-k interconnect (BEOL) for 28 nm CMOS technologies
- R. Augur
- C. Child
- et al.
- 2012
- Microelectronic Engineering