Electrical characteristics of lossy interconnections for high-performance computer applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
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12 results for S. Nunes
Adhesion properties of a structural etch stop material for use in multilayer electronic wiring structures
- R.A. Haring
- Sharon L. Nunes
- et al.
- 1995
- Journal of Materials Research
IBM research: Ultimate source for new businesses
- Sharon Nunes
- 2004
- Research Technology Management
In‐plane solvent diffusion in a photosensitive polyimide
- Da‐Yuan Shih
- Sharon Nunes
- et al.
- 2003
- Journal of Applied Polymer Science
Characterization of water vapor plasma‐modified polyimide
- R.D. Goldblatt
- L. Ferreiro
- et al.
- 2003
- Journal of Applied Polymer Science
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Cu passivation: A method of inhibiting copper-polyamic acid interactions
- D.Y. Shih
- J. Kim
- et al.
- 1991
- Applied Physics Letters
Thin-film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries
- D.Y. Shih
- C.A. Chang
- et al.
- 1991
- Journal of Applied Physics
Oxygen induced adhesion degradation at metai/polyimide interface
- Da-Yuan Shih
- Nancy Klymko
- et al.
- 1991
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
RBS analysis of Si diffusion in photoresist during silylation
- P.B. Madakson
- S. Nunes
- et al.
- 1990
- Nuclear Inst. and Methods in Physics Research, B