The application of a novel UV fs Laser Ablation Ionization Mass Spectrometry approach for chemical depth profiling of low-melting point, high surface roughness SnAg solder bump features is presented. The obtained submicrometer resolved three-dimensional compositional data reveal unprecedented information on the distribution of individual elements inside the solder bump matrix. Moreover, the determination of matrix-matched relative sensitivity coefficients allows the first report on quantitative assessment of the SnAg alloy composition. These results significantly contribute to an in-depth understanding of the SnAg plating process. This experimental procedure may find application in future additive performance screening.