Investigations of silicon nano-crystal floating gate memories
Arvind Kumar, Jeffrey J. Welser, et al.
MRS Spring 2000
Bonding of Cu/Cr films to several polyimides has been studied as a function of polymer surface modification by ion beam and chemical pretreatment. The effects of the metal deposition method and parameters have also been examined. The materials of interest include a low thermal expansion polyimide derived from 3, 3‘, 4, 4’-biphenyl tetracarboxylic acid dianhydride-p-phenylene diamine (BPDA-PDA) polyamic acid, and pyromellitic dianhydride-4, 4 oxydianiline (PMDA-ODA) polyimide, formed from polyamic acid or polyamide ethyl ester precursors. The metal/polyimide adhesive strength was determined by the 90° peel test, while the interfacial regions were examined using x-ray photoelectron spectroscopy and ellipsometry. It is found that for PMDA-ODA systems, exposure to low energy Ar + and/or O2+ ions improves adhesion of the metal overlayer, while for BPDA-PDA polyimide, the role of O2+ is more significant. The fracture location is found to lie 20–300 A within the polymer, depending upon the ion beam dose and the specific polyimide employed. © 1991 American Vacuum Society
Arvind Kumar, Jeffrey J. Welser, et al.
MRS Spring 2000
I.K. Pour, D.J. Krajnovich, et al.
SPIE Optical Materials for High Average Power Lasers 1992
Ming L. Yu
Physical Review B
R. Ghez, M.B. Small
JES