IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Short-Pulse Propagation Technique for Characterizing Resistive Package Interconnections

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A novel technique for completely characterizing the frequency-dependent electrical properties of resistive transmission lines by short-pulse propagation is described. Time-domain measurements of the loss and dispersion of pulses propagated on two different lengths of the line under investigation, together with the measured low-frequency capacitance, are used to determine its broadband complex propagation constant and complex impedance. The technique is illustrated with measurements on a thin film package interconnection structure. The measured line characteristics are then used in a transient circuit analysis program to predict output waveforms generated by logic-like signals. © 1992 IEEE