IRPS 2016
Conference paper

Process optimizations for NBTI/PBTI for future replacement metal gate technologies

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Bias Temperature Instability (BTI) is a tremendous reliability concern for deeply scaled CMOS technologies, and is the limiting mechanism for further inversion layer thickness (Tinv) scaling for future nodes [1]. Replacement Metal Gate technologies are of particular concern, since the gate stack is not exposed to the high temperature source/drain anneals. We have identified four strategies for reducing BTI in Replacement metal gate technologies: Rapid Thermal Anneal (RTA) optimization, optimization of the HfO2 layer thickness, introducing a gate dielectric dopant for NBTI reduction, and effective Work Function tuning. Judiciously combining these four techniques enable further Tinv scaling for 10 nm and below.