IEEE Transactions on Advanced Packaging

Prediction of losses caused by roughness of metallization in printed-circuit boards

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In this paper, the effect of metal roughness on the total loss, the extracted tan δ, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, 2-D, causal, broadband modeling methodology is shown. © 2007 IEEE.